Dow has unveiled a new thermal management material aimed at tackling one of the biggest bottlenecks in next-generation electronics: heat.

 

The company announced the launch of DOWSIL TC-3120 Thermal Gel, a silicone-based thermal gel designed to deliver optical-grade cleanliness while maximizing heat transfer performance in dense, high-speed electronic systems.

 

Positioned for 800G and 1.6T optical modules, as well as advanced telecommunications, optical transceivers, automotive electronics, and autonomous vehicle systems, the material targets applications where extreme data speeds generate intense thermal loads.

 

Dow says the gel delivers thermal conductivity of ~12 W/m·K—the highest among its commercially available silicone gels—while also reducing oil bleeding and condensed outgassing, two common contamination risks that can degrade optical and electronic reliability.

 

The company emphasized its focus on cleanliness for sensitive optical environments, where even minor contamination can impact performance.

 

“DOWSIL TC-3120 Thermal Gel maximizes thermal transfers without sacrificing reliability, especially in optical and high-speed data applications,” said Cathy Chu, Global Strategic Marketing Director, Consumer & Electronics, Dow. “It is also highly efficient to process.”

 

Unlike many ultra-high thermal conductivity materials, the gel is designed to remain easily dispensable, supporting controlled extrusion and consistent bond-line formation even in manufacturing environments.

 

It is supplied as a flowable paste and can be compressed to a minimum bond line thickness of 200 µm, enabling efficient heat transfer across uneven or tolerance-stacked surfaces. The one-part system is also reworkable, with heat-assisted curing available for faster processing.

 

Dow highlighted additional durability benefits, including resistance to high temperature, humidity, shock, vibration, and repeated thermal cycling. The material also resists slumping in vertically oriented assemblies such as optical transceivers and is engineered to maintain stability under mechanical stress.

 

The launch strengthens Dow’s broader Dow Cooling Science platform, which integrates materials science with thermal engineering support to help improve efficiency and reliability in advanced electronic systems.