Mitsubishi Chemical Corporation is moving to strengthen its position in the cutting-edge semiconductor materials market, announcing plans to commercialize ultra-high-purity colloidal silica for advanced semiconductor polishing applications.

 

The company will build new production facilities at its Kyushu Plant in Kitakyushu, Fukuoka Prefecture, with commercial operations scheduled to begin in October 2028.

 

The material will be used as a raw material for polishing agents for silicon wafers and for chemical mechanical polishing (CMP) slurries used on silicon wafer interconnect layers.

 

As semiconductor manufacturing pushes toward increasingly smaller and more complex structures, polishing processes must deliver high material removal rates while achieving nanoscale surface flatness, controlling impurities and minimizing scratches. The required particle shape and physical properties of colloidal silica vary depending on the material being polished.

 

Mitsubishi Chemical said its new ultra-high-purity colloidal silica will be manufactured through an integrated process using ultra-high-purity tetramethoxysilane designed to minimize impurities.

 

The company will also draw on its long-standing technical expertise to tailor key properties, including particle size and density, to meet individual customer requirements.

 

The move comes as demand for advanced semiconductors is expected to accelerate, fueled by rapid growth in generative AI and data centers.

 

Under its management vision, “KAITEKI Vision 35,” Mitsubishi Chemical has identified “Enable advanced data processing and telecommunications” as a key business focus. The company said the new business will support that strategy by supplying critical materials for advanced semiconductor manufacturing and strengthening the global materials supply chain underpinning semiconductor technology.

 

With commercial production targeted for 2028, Mitsubishi Chemical is positioning ultra-high-purity colloidal silica as another critical material in the race to meet the demands of next-generation semiconductor manufacturing.