Sumitomo Chemical has announced that its Korean subsidiary Dongwoo Fine-Chem Co., Ltd. will partner with Samsung Electro-Mechanics Co., Ltd. to form a joint venture focused on glass core substrates for advanced semiconductor packages. 

 

The new company is slated for establishment in 2026, pending regulatory approvals.

 

The move comes as surging demand for generative AI, data center expansion, and high-performance computing pushes semiconductor packages toward larger, denser, and more power-efficient designs. That shift is accelerating interest in glass core substrates as a next-generation solution.

 

"Glass core substrates are next-generation semiconductor package substrates with features such as excellent rigidity, dimensional stability, low warpage, and low thermal expansion, which contribute to larger package sizes, improved reliability, and higher-density wiring.” 

 

The announcement highlights that AI-driven semiconductors are expected to require even greater scaling, positioning glass substrates for a potential full commercial rollout.

 

Dongwoo Fine-Chem brings established expertise in thin-glass manufacturing, large-area glass handling automation, and high-precision clean production systems. The company says it will support the venture from development and ramp-up through to full-scale mass production, leveraging its existing infrastructure and engineering capabilities.

 

Samsung Electro-Mechanics contributes deep experience in advanced semiconductor package substrates and high-density circuit design, with a track record in AI server components and large-scale manufacturing commercialization. The company has also been actively developing glass core substrate technology from an early stage.

 

The joint venture will combine these capabilities to build a dedicated supply chain for glass core substrates, with production expected to ramp up by the second half of fiscal 2027. Capacity is planned to expand progressively as demand grows.

 

Sumitomo Chemical said the initiative aligns with its strategy to strengthen semiconductor-related businesses, particularly in ICT. The company has already expanded its front-end semiconductor materials portfolio and is now accelerating development in back-end areas such as packaging and substrate technologies.

 

Through the new venture, the group aims to reinforce its position in next-generation semiconductor packaging and support the broader development of the semiconductor ecosystem.

 

The venture, tentatively named GlaSSEM, will be based in Pyeongtaek-si, Gyeonggi-do, South Korea, and led by Lee Dongwoo. 

 

It will focus on the development, manufacturing, and sales of glass core substrates for advanced semiconductor packages. Capital is set at KRW 482.1 billion, with ownership split between Samsung Electro-Mechanics (66%) and Dongwoo Fine-Chem (34%). The company is expected to be established in 2026.