Linde to invest $1 billion for major US chip plant expansion

By: ICN Bureau

Last updated : July 31, 2026 3:05 pm



Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure


Linde has finalized a major long-term agreement to supply ultra-high-purity industrial gases to a leading global semiconductor manufacturer. This partnership will fuel the expansion of the client’s manufacturing hub in Phoenix, Arizona.

To meet this demand, Linde plans to invest $1 billion to upscale its current Phoenix facilities. This expansion represents one of Linde's most significant global financial commitments to an electronics customer.

Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure. The new units will complement the three existing ASUs at the site. 

The expansion will increase Linde’s supply of ultra-high-purity nitrogen, oxygen and argon to support two new semiconductor fabrication facilities. The new plants will use Linde’s leading-edge SPECTRA® technology to deliver the purity, reliability and operating efficiency required for advanced semiconductor manufacturing. 

Separately, Linde LienHwa, Linde’s joint venture partner in Taiwan, has been selected by the same customer to supply industrial gases to new semiconductor manufacturing and advanced packaging facilities at multiple sites in Taiwan. Linde LienHwa plans to invest approximately $800 million to build, own and operate several ASUs and hydrogen production units. 

“Advanced semiconductor manufacturing depends on the reliable supply of gases at exceptional levels of purity,” said Armando Botello, President Linde Gases, US. “As global demand for advanced semiconductors continues to increase, this investment demonstrates Linde’s ability to deliver the purity, reliability and scale our customers require. We are proud to support our customer’s expansion in the United States and Taiwan and to further strengthen our long-term global relationship.”

Linde industrial gases semiconductor chip advanced packaging

First Published : July 31, 2026 12:00 am