LG Chem is stepping up its push into the fast-growing AI semiconductor market, showcasing a broad portfolio of advanced packaging and power semiconductor materials at SEMICON Taiwan 2026 next week.

 

The company will exhibit at the event, Asia’s largest semiconductor exhibition, from September 2 to 4 at the Taipei Nangang Exhibition Center in Taipei, Taiwan, targeting high-growth applications including high-bandwidth memory (HBM), AI semiconductors and high-performance computing (HPC).

 

LG Chem will highlight materials designed to meet the increasingly demanding performance, thermal management and fine-pitch requirements of next-generation semiconductors.

 

The company’s Advanced Package Zone will showcase a wide range of materials for advanced packaging, including copper clad laminates (CCL), glass core solutions, build-up films, dry film solder resist (DFSR), photo imageable dielectrics (PID), die attach films (DAF), bonding and debonding solutions, and strippers for fine-pitch processes.

 

LG Chem will also spotlight its power semiconductor portfolio in a dedicated Power Package Zone. The lineup includes conductive sintering pastes using silver and copper, thermal interface materials (TIM), and copper metal foam-based thermal management devices designed to boost power efficiency and heat dissipation in AI data centers.

 

SEMICON Taiwan brings together semiconductor manufacturers, outsourced semiconductor assembly and test (OSAT) companies, substrate makers and packaging firms, making the event a major venue for technology exchange and business development across the semiconductor supply chain.

 

LG Chem plans to use the exhibition to deepen ties with major semiconductor customers, identify new project opportunities and expand its customer base in AI semiconductors and advanced packaging. The company also aims to accelerate growth in its semiconductor materials business through technology exchanges and closer industry collaboration.

 

“As the AI semiconductor and advanced packaging markets continue to expand, customer demand for high-performance materials is increasing,” said Kim Dong Choon, CEO of LG Chem. “Building on our differentiated materials portfolio, LG Chem will strengthen collaboration with semiconductor customers and actively pursue growth opportunities in the semiconductor market of the future.”