SABIC has introduced ULTEM DU762 resin, a specialty thermoplastic designed to give smartphone manufacturers a lighter, more cost-effective alternative to metal middle frames—without sacrificing premium aesthetics or structural performance.

 

The new polyetherimide (PEI) resin is compatible with non-conductive physical vapor deposition (PVD) sputtering, enabling manufacturers to create a high-gloss metallic finish while retaining the design and manufacturing advantages of a polymer.

 

“Consumers choosing top-of-the-line smartphones demand premium materials that complement cutting-edge technologies, such as artificial intelligence (AI),” said Sergi Monros, vice president, Specialties business unit, SABIC. 

 

“Our new ULTEM DU762 resin offers high quality without the drawbacks of traditional materials. It delivers great value through design flexibility and streamlined production while meeting rigorous standards for aesthetics and performance. As smartphone styling and capabilities advance, SABIC remains aligned with the evolving needs of the consumer electronics industry.”

 

SABIC says ULTEM DU762 resin can be manufactured through high-speed, high-volume injection molding, offering a potential cost advantage over titanium, stainless steel and aluminum frames that require time-consuming machining.

 

The material is also significantly lighter than conventional metal options, potentially helping smartphone makers reduce weight while maintaining the strength and durability required for structural components.

 

Its non-conductive nature delivers another design advantage: manufacturers can metallize the polymer without requiring the antenna splits commonly seen in metal smartphone frames. Those plastic breaks can disrupt the visual uniformity of a device and limit styling options.

 

SABIC is also positioning ULTEM DU762 as an alternative to glass fiber-reinforced polycarbonate (PC), which typically relies on non-conductive vacuum metallization (NCVM).

 

According to SABIC, the multi-layer NCVM process can produce thicker coatings that build up around edges and corners, making it harder to achieve the sharp, clean lines demanded by premium smartphone designs.

 

PVD metallization, by comparison, creates a much thinner coating through a simpler process. The unreinforced ULTEM DU762 resin also avoids the potential migration of glass fibers in PC, helping deliver a smoother, more uniform high-gloss surface.

 

The material is designed to withstand abrasion and cracking better than softer PC resins, while also offering high heat resistance and strong resistance to sunscreen and other chemicals.

 

ULTEM DU762 resin is now available globally, giving smartphone manufacturers another option as they push toward thinner, lighter and increasingly sophisticated premium devices.