By: ICN Bureau
Last updated : November 05, 2025 3:18 pm
Strengthening strategic cooperation for next-generation semiconductor package core material 'Glass Core'
Samsung Electro-Mechanics and Sumitomo Chemical have signed a memorandum of understanding (MoU) to form a joint venture (JV) for the manufacturing of glass core substrates, a next-generation semiconductor packaging material.
The JV aims to accelerate the commercialization, manufacturing, and supply of glass core substrates, which are crucial for advanced semiconductor packaging used in AI servers and autonomous driving applications.
Through this MOU, Samsung Electro-Mechanics, Sumitomo Chemical, and Dongwoo Fine-Chem will leverage their respective technological strengths and global networks to establish manufacturing and supply capabilities for 'Glass Core' and accelerate market expansion.
In the JV, Samsung Electro-Mechanics will serve as the primary investor with a majority stake, while Sumitomo Chemical Group will participate as a minority shareholder. The companies plan to finalize details such as the shareholding structure, business schedule, and corporate name, aiming to sign the main agreement next year. The headquarters will be located at Dongwoo Fine-Chem’s Pyeongtaek site, which will also serve as the initial production base for 'Glass Core'.
Chang Duckhyun, President of Samsung Electro-Mechanics, said, “This agreement will provide an opportunity to combine the advanced capabilities of the three companies and establish a new growth engine in the next-generation semiconductor package market. We will continue to strengthen our technological leadership and take the lead in building an advanced package substrate ecosystem.”
Keiichi Iwata, the Chairman of Sumitomo Chemical said, “Through cooperation with Samsung Electro-Mechanics, we expect to generate significant synergy in the advanced semiconductor back-end process sector. We will further solidify our long-term partnership through this project.”
Lee Jongchan, the President of Dongwoo Fine-Chem added, “Based on the technology accumulated by Sumitomo Chemical, we will actively utilize our strong execution capabilities and infrastructure to ensure the success of this collaboration and grow into a leading company in advanced semiconductor packaging materials.”
Samsung Electro-Mechanics is currently producing glass package substrate prototypes at its Sejong plant pilot line. Mass production is planned to begin with the joint venture after 2027.