By: ICN Bureau
Last updated : October 20, 2026 11:02 pm
Establishing new production capacity for semiconductor materials supporting chip technologies below 2 nanometers
BASF has signed a Letter of Intent (LoI) with Taiwan’s Ministry of Economic Affairs (MOEA) to strengthen its long-term commitment to the country's growing semiconductor ecosystem.
With this investment, BASF’s Electronic Materials business is expanding its Kuanyin site in Taoyuan. The upgrade adds production capacity for advanced semiconductor materials, boosts quality analysis capabilities, and grows its Innovation Center. This expansion will meet the rising global demand for next-generation semiconductor technologies—specifically advanced nodes below 2 nanometers—while improving supply chain resilience and proximity to customers.
“Taiwan is a global hub for semiconductor innovation and manufacturing, with leading-edge process technologies and a highly integrated industry ecosystem. Setting the strategic base for BASF’s global Electronic Materials operations in Taiwan in 2025 reflected the strategic importance of Taiwan within the global semiconductor ecosystem and reinforced our confidence in the market’s long-term growth potential,” said Gops Pillay, President, Global Operating Division of BASF.
BASF is expanding its Kuanyin site in Taiwan to meet the soaring demand for ultra-high-purity specialty chemicals as the semiconductor industry advances below the 2-nanometer node. This strategic investment boosts the site’s Innovation Center, scaling up technical and analytical capabilities to power next-generation, AI-era chip technologies. By deepening ties with local industry leaders, BASF aims to co-develop cutting-edge materials and solidify Taiwan's status as a global semiconductor hub.
The investment will further strengthen BASF’s local manufacturing, quality assurance and technical service capabilities in Taiwan, enabling the company to provide customers with a more reliable supply of advanced semiconductor materials, faster technical support, and closer collaboration. At the same time, it will enhance supply chain resilience and reinforce BASF’s role as a trusted long-term partner to the semiconductor industry.
“The signing of this Letter of Intent marks another important milestone in BASF’s long-term commitment to the semiconductor industry,” said Jens Liebermann, Senior Vice President, Global Electronic Materials business and Chairman of BASF Taiwan. “As semiconductor technologies continue to advance, innovation in materials must keep pace with our customers’ evolving needs. By strengthening our local manufacturing, innovation, and technical service capabilities, we are deepening collaboration with our customers and accelerating the development of materials solutions for future technology generations, while further enhancing supply chain resilience.”