German electrical engineering major Weidmüller is turning to chemicals giant BASF’s advanced materials to power the next generation of high-performance electronics.

 

In fact, the company has selected BASF’s Ultramid Advanced N3U41 G6 for the PCB connectors and terminals in its new OMNIMATE 4.0 product family.

 

The move signals a major push toward faster, more automated, and more durable electronics manufacturing for sectors including drive technology, power supply, and energy distribution.

 

At the center of the collaboration is BASF’s high-performance polyphthalamide (PPA), engineered to withstand extreme thermal and environmental demands while offering flexible color customization in industry-standard RAL shades such as orange, blue, and green. 

 

The material’s high temperature resistance also makes it suitable for reflow soldering, a critical process in modern PCB assembly.

 

Ultramid Advanced N3U41 G6 enables manufacturers to produce connectors and PCB terminals in customized colors while maintaining full UL certification across all color variants — a key advantage for electronics makers requiring strict color coding for safe assembly and maintenance.

 

“We are delighted that we were able to convince Weidmüller both with our high-performance material and with the wide range of colors available,” says Andreas Stockheim from business management for PPAs at BASF. 

 

“BASF is the leading company on the market offering customers a broad selection of pre-colored granules for this PA9T and other PPAs. It is also possible to use UL-certified masterbatches for self-coloring.”

 

Weidmüller says the material aligns closely with the automation-focused design philosophy behind its OMNIMATE 4.0 platform. The company’s PCB components are built to deliver compact power transmission while meeting demanding high-voltage requirements. 

 

Snap-in connection technology also allows rapid, tool-free wiring, reducing assembly time and boosting manufacturing efficiency.

 

“Our OMNIMATE 4.0 product family is ideally suited for fully automated wiring processes,” says Johann Klippenstein, Head of Device Connectors at Weidmüller. 

 

“The BASF PPA fits perfectly into this concept, as its mechanical and electrical properties remain at a high level even in small connectors. Combined with the exceptionally wide color palette, we offer our customers a safe solution that complies with DIN standard VDE 60335-1 and can be flexibly adapted to new requirements in high performance electronics.”

 

The material also addresses mounting pressure on electronics manufacturers to build smaller, tougher, and more heat-resistant components. 

 

BASF’s laser-sensitive Ultramid Advanced N3U41 G6 LS combines non-halogenated flame retardancy with low water absorption, high dimensional stability, and strong electrical performance even in harsh environments exposed to moisture, dust, and dirt.

 

With a comparative tracking index (CTI) of 600 and a relative thermal index (RTI) of 150°C, the material is designed to support the growing miniaturization of electronic components without compromising reliability or safety.