SABIC launches EXTEM RH1016UCL resin, a new ultra-high-heat, near-infrared (IR)-transparent grade well-suited for injection-molded lenses used in co-packaged optical transceivers and other optical connectors at the ECOC Exhibition 2022.

EXTEM RH1016UCL resin is one of the first IR-transparent thermoplastics that can robustly withstand the 260°C peak temperature of printed circuit board (PCB) reflow soldering while maintaining dimensional stability of the molded part. This capability helps enable optical connectors to be mounted with other components in one step, avoiding the separate assembly and alignment processes that are required for lower-temperature lens materials.

The new EXTEM resin also provides high-throughput, precision micro-molding capability for enhanced productivity. Together with optical design freedom and breakthrough high-temperature performance, this new resin can help customers transition from pluggable optics to co-packaged optics that support increased data center speed, scale and energy efficiency. EXTEM RH1016UCL resin has been validated by a major technology OEM in the United States.

The new EXTEM RH1016UCL resin will be featured in a presentation by SABIC’s Chief Scientist, Gabrie Hoogland, at the International Symposium for Optical Interconnect in Data Centres, part of ECOC 2022.

“Co-packaged optics are a next-generation technology that can help increase data center reliability and reduce power usage and costs by bringing the optics much closer to the main switching ASIC,” said Florian Jung, global business manager, ULTEM and EXTEM, SABIC’s Specialties Business. “Producing complex, miniaturized lenses and arrays for co-packaged optics calls for new materials that can overcome the design, manufacturing scalability and system cost drawbacks of glass. SABIC’s new EXTEM RH1016UCL resin addresses these needs while helping to advance this emerging technology and opening new opportunities to help improve PCB integration density and energy efficiency.”