The function for commencement of construction of Tata’s semiconductor unit in Assam unit was held on August 3, 2024 n the presence of Chief Minister of Assam Himanta Biswa Sarma and Chairman of Tata Sons Limited N Chandrasekaran.

Later, the Union Minister for Railways, Electronics & Information Technology and Information and Broadcasting, Ashwini Vaishnav, during his interaction with the media, stated that this project was approved by the Union Cabinet on 29th February, 2024

Vaishnav mentioned that this unit will be set up with an investment of Rs. 27,000 crores and is expected to generate 15,000 direct and 11,000 – 13,000 indirect jobs. While highlighting the importance of the Semiconductor industry as being a foundational one, he said that employment opportunities in various upstream and downstream industries will be created.

The proposed capacity of this unit is 4.83 crore semiconductor chips per day. He also pointed out that this unit will be the site for development of indigenous advanced semiconductor packaging technologies including Wire Bond, flip chip and I-SIP (integrated system in package) technologies and all these three major technologies which will be deployed in this plant are being developed in India. These technologies are extremely critical for key applications such as automotive (especially electric vehicles), communications, network infrastructure and others.