Gas

Air Products expands Taiwan semiconductor push with major gas supply network investment

Air Products San Fu will build, own, and operate four large-scale, state-of-the-art air separation units

  • By ICN Bureau | July 23, 2026
Air Products is deepening its role in Taiwan’s semiconductor boom with a major expansion of its industrial gas supply network, signing a long-term agreement to support a leading semiconductor manufacturer’s next-generation facility growth.
 
The company announced that Air Products San Fu has been selected to supply multiple new semiconductor fabrication plants and advanced back-end packaging facilities in Taiwan, helping meet surging demand fueled by artificial intelligence and high-performance computing.
 
Under the agreement, Air Products San Fu will build, own, and operate four large-scale, state-of-the-art air separation units along with bulk gas supply systems and new underground pipeline infrastructure. The project will deliver critical industrial gases — including nitrogen, oxygen, argon, and helium — required for advanced semiconductor manufacturing.
 
The new underground pipeline network will connect with Air Products’ existing pipeline infrastructure in Taiwan, strengthening supply reliability, improving operational efficiency, and adding resilience to one of the world’s most important semiconductor manufacturing hubs.
 
“Air Products is honored to be selected by our strategic customer to support their continued growth, building on our proven track record and strong long-term partnership,” said Paul Yang, President, Air Products San Fu. 
 
“This project further reinforces our role as a trusted supplier in Taiwan and reflects our long-term commitment to grow with our customers. It also underscores our world-class performance in safety, reliability and operational excellence, which are critical to meeting the increasingly demanding requirements of the electronics industry.”
 
The latest investment strengthens Air Products’ integrated supply capabilities across both front-end semiconductor manufacturing and advanced packaging — two critical areas driving the future of the global electronics industry.

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