Based on its proven ALBIFLEX technology, Evonik has developed a new epoxy-silicone copolymer, ALBIFLEX® 297. This new epoxy resin was first presented at the "International Conference on Electrical, Communication and Computer Engineering" (ICECCE) at the end of last year and is now been officially available for electronics industry customers in all regions.

ALBIFLEX 297 offers an optimal combination of flexibility with chemical and thermal stability that prevents material fatigue helping to increase the service life of the respective application. It also has excellent electrical and dielectric properties, high impact resistance, and nearly infinite variable elongation. In contrast to typical rigid and brittle epoxy resins, ALBIFLEX 297 offers very high material flexibility of up to 145%, achieved by using the right mixing ratio with a standard resin.

This product can be used in a broad range of applications. In sensor encapsulation, for example, the epoxy resin provides permanent protection for electronic components against external influences such as heat, moisture, vibration, or chemical effects. In addition, it can be used in fatigue-free adhesives, flexible substrates (e.g., copper-coated laminates), films or optical applications.

"ALBIFLEX® 297 is particularly suitable for the fast-growing market for elastic adhesives, bonding and sealing compounds in electrical engineering and electronics," said Stefan Schumann, Technical Director at Evonik Interface & Performance. “In addition, our customers can use our innovative new ALBIFLEX® copolymer as a substrate material for flexible printed circuit boards, and as a base polymer or additive for potting compounds in increasingly more sophisticated electronic components.”