SABIC has unveiled a new generation of thermoplastic compounds designed to meet the growing demands of high-voltage, high-power electronic systems, including electric vehicle traction inverters, fast-charging infrastructure and renewable energy applications.
The new LNP THERMOCOMP OFM76XXP and OFM76EXP compounds are engineered for critical power electronics components such as insulated gate bipolar transistor (IGBT) power switching devices.
Based on polyphenylene sulfide (PPS) resin, the materials combine high impact strength, dimensional stability, electrical insulation performance and resistance to thermal shock — helping manufacturers develop smaller, lighter and more reliable power modules.
"Higher voltages, greater power densities and miniaturization are driving manufacturers of critical power electronic devices like IGBT switches to choose materials that help enhance stability and power,” said Sergi Monros, vice president, Specialties Business.
“Our experts stay ahead of changing customer requirements through proactive development of specialty thermoplastics that surpass existing solutions. We continue to enhance our renowned portfolio of LNP compounds with new capabilities, higher performance and extended reliability.”
Built to address increasingly demanding requirements in high-voltage applications, the new compounds deliver a robust comparative tracking index (CTI-PLC 0), dielectric strength for effective insulation and UL94 V0 flame retardancy. SABIC said the materials retain 90% of their strength and insulation capability after 1,000 hours of heat aging at 200°C.
Compared with traditional polybutylene terephthalate (PBT) and polyphthalamide (PPA) materials, the new LNP THERMOCOMP grades offer improved dimensional stability and stronger resistance to thermal shock. Their thin-wall flame-retardant capability — achieving UL94 V0 performance at 0.4mm — supports compact designs for next-generation power systems.
The materials can also be produced in white and light colors, enabling better visibility of mandatory QR codes printed on IGBT components.
The flagship LNP THERMOCOMP OFM76EXP grade delivers additional advantages, including enhanced laser-marking performance, the highest impact strength among comparable materials, adhesion to silicone-based sealants and improved crack resistance.
"Higher voltages, greater efficiency and compact designs are reshaping the future of power electronics,” SABIC said, with the new compounds aimed at helping manufacturers meet those evolving performance challenges.
