Total investment in semiconductor units in India reaches Rs.1.60 lakh crore
The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four additional semiconductor manufacturing projects under the India Semiconductor Mission (ISM), further strengthening the country’s semiconductor ecosystem.
Building on momentum from six earlier approved projects already under execution, these four new proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.
These projects represent a cumulative investment of approximately Rs.4,600 crore and are expected to generate employment for over 2,000 skilled professionals, significantly boosting the electronic manufacturing ecosystem and creating numerous indirect jobs. With these approvals, the total number of projects sanctioned under ISM rises to ten, with cumulative investments nearing Rs.1.60 lakh crore across six states.
Given the rising demand for semiconductors in telecom, automotive, data centers, consumer electronics, and industrial sectors, these new projects will play a vital role in advancing the Atmanirbhar Bharat initiative.
Project Locations and Highlights:
SiCSem Private Limited (Odisha): In collaboration with Clas-SiC Wafer Fab Ltd., UK, SiCSem will establish India’s first commercial compound semiconductor fab in Info Valley, Bhubaneshwar. The facility will manufacture Silicon Carbide (SiC) devices with an annual capacity of 60,000 wafers and packaging capacity of 96 million units. These products will serve applications in defense (missiles and equipment), electric vehicles (EVs), railways, fast chargers, data centers, consumer appliances, and solar power inverters.
3D Glass Solutions Inc. (3DGS) (Odisha): Setting up a vertically integrated advanced packaging and embedded glass substrate unit also in Info Valley, Bhubaneshwar, this facility will introduce cutting-edge packaging technologies to India. It will feature glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. Planned capacity includes 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually. The products will have critical applications in defense, high-performance computing, artificial intelligence, RF and automotive sectors, photonics, and co-packaged optics.
Advanced System in Package Technologies (ASIP) (Andhra Pradesh): Partnering with APACT Co. Ltd, South Korea, ASIP will set up a semiconductor manufacturing unit with an annual capacity of 96 million units. The products will target mobile phones, set-top boxes, automobile electronics, and other electronic devices.
Continental Device India Limited (CDIL) (Punjab): Expanding its existing discrete semiconductor manufacturing facility at Mohali, CDIL will produce high-power discrete semiconductor devices including MOSFETs, IGBTs, Schottky bypass diodes, and transistors, in both silicon and silicon carbide. The brownfield expansion will have an annual capacity of approximately 158.38 million units. These devices will support automotive electronics including EVs and charging infrastructure, renewable energy systems, power conversion, industrial applications, and communication infrastructure.
With these approvals, India’s semiconductor ecosystem receives a significant boost, featuring the country’s first commercial compound semiconductor fab and an advanced glass-based substrate packaging unit. These developments complement the expanding world-class chip design capabilities in India, supported by government initiatives benefiting 278 academic institutions and 72 startups.
More than 60,000 students have already benefited from talent development programs aimed at building a skilled workforce to support the growing semiconductor industry.
Register Now to Attend Chem Connect 2025 on August 21th 2025, Novotel Mumbai International Airport
Subscribe To Our Newsletter & Stay Updated