Mitsubishi Chemical Group (MCG), a global leader in advanced materials, has announced a strategic partnership with Boston Materials, a specialist in advanced energy transfer materials.
The collaboration, which includes an investment from MCG’s U.S.-based corporate venture arm, Diamond Edge Ventures, aims to transform thermal management in high-performance computing (HPC) and AI data centers.
The companies will co-develop the second-generation Liquid Metal ZRT product, a breakthrough thermal interface material (TIM) leveraging Boston Materials’ patented Z-axis Carbon Fiber technology and proprietary liquid metal alloys. In addition, Boston Materials will gain access to MCG’s extensive supply chain for high-performance electronic materials.
"The semiconductor industry is at an inflection point where material innovation is essential for continued performance scaling," said Curtis Schickner, President of Diamond Edge Ventures.
"Boston Materials' Liquid Metal ZRT thermal interface material presents a clear solution to thermal management, one of the semiconductor industry's most pressing bottlenecks. Mitsubishi Chemical Group has vetted and confirmed this product's performance superiority over existing and next-generation thermal management solutions. As a result, we have selected Boston Materials as a strategic partner to expand Mitsubishi Chemical Group's comprehensive, high-performance solutions for the semiconductor industry."
Thermal management has become a major bottleneck for HPC and AI compute performance. Boston Materials’ first-generation Liquid Metal ZRT product, LMZ1100, has already delivered more than 10°C of cooling improvement for kilowatt-scale, liquid-cooled ASICs and GPUs, while ensuring long-term reliability and compatibility with high-volume manufacturing processes.
The new collaboration will accelerate development of the second-generation product, enhancing both thermal performance and reliability, and scaling integration into semiconductor assembly.
The partnership also aligns with MCG’s broader strategy to strengthen its position as a premier supplier of high-performance materials for the semiconductor industry. The company plans to open advanced semiconductor packaging and application labs in Asia to support commercialization and mass deployment of the second-generation Liquid Metal ZRT product across the APAC region.
"Thermal management is now a key bottleneck for the advancement of AI infrastructure," said Anvesh Gurijala, Chief Executive Officer of Boston Materials. "Boston Materials has commercialized the Liquid Metal ZRT product to solve this critical bottleneck, and now we have forged this strategic partnership with Mitsubishi Chemical Group to expand our worldwide deployment reach and accelerate our product roadmap."
