Chemical
Air Liquide launches advanced materials plant in Taiwan
The facility, at the heart of Taiwan’s semiconductor hub, will produce highly engineered molecules for nano-scale processes, including Atomic Layer Deposition
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By ICN Bureau | March 28, 2026
Air Liquide is accelerating its leadership in electronics in Asia, by providing semiconductor leaders with the materials they need for the next generation of high-performance chips.
And as a major stride, the company has unveiled its new Advanced Materials manufacturing plant in Taichung City in Taiwan, one of the world’s most innovative semiconductor markets.
Already operating 54 facilities in Taiwan, this is the company’s first large-scale production site for advanced deposition and etching materials in the country—critical components for next-generation chips powering Artificial Intelligence and High-Performance Computing.
The facility, at the heart of Taiwan’s semiconductor hub, will produce highly engineered molecules for nano-scale processes, including Atomic Layer Deposition (ALD). As chipmakers push semiconductors toward atomic-scale miniaturization, the reliability and performance of these materials have become strategic imperatives.
By localizing production near key semiconductor manufacturers, Air Liquide strengthens supply chain reliability while enabling faster innovation.
“This new plant, strategically located in Taiwan, one of the most dynamic semiconductor hubs in the world, underlines our ambition to power the next wave of technological innovation, including AI," said Armelle Levieux, member of Air Liquide’s Executive Committee.
"As the industry leader in Advanced Materials for the semiconductor industry, Air Liquide is committed to strengthening its partnerships with the most advanced chipmakers in the world by providing them with state-of-the-art molecules in a context of rapid expansion. This inauguration also represents a significant milestone in our growth story in Asia, consolidating our footprint in this continent."
