Asahi Kasei has developed the TA Series of Sunfort dry film photoresist as a new product designed to meet growing demand in the field of advanced semiconductor packages used in applications such as artificial intelligence (AI) servers.

This product is positioned as a strategic offering within Asahi Kasei's Material sector, aiming to strengthen its footprint in the rapidly growing market for next-generation chip packaging. The dry film delivers an ultra-high resolution with conventional stepper exposure systems and laser direct imaging (LDI) systems, which transfer circuit patterns onto substrates during packaging, contributing to enhanced performance and precision in back-end processes.

Sunfort dry film photoresist is a mainstay of Asahi Kasei’s Electronics business, comprising electronic materials and electronic components, which is positioned as a First Priority business to drive growth from fiscal 2025–2027 under the medium-term management plan “Trailblaze Together.”

Sunfort dry film photoresist will continue to play a key role in developing panel-level packaging technology as panel sizes grow. The new TA Series allows manufacturers to achieve finer wiring with greater production efficiency, helping to reduce cost and increase yield in advanced semiconductor packaging. Asahi Kasei’s TA Series comes at a pivotal time as demand in AI, automotive, and IoT markets grows.

“The development of the TA Series comes after years of close collaboration with our customers and a deep understanding of their most pressing pain points. Through this development, we address the evolving requirements of semiconductor packaging in AI, automotive, and IoT applications,” said Yu Hasegawa, Managing Executive and Senior General Manager of the Electronics Interconnecting Materials Division at Asahi Kasei.

“With growing demand, particularly in Asia and North America, we at Asahi Kasei are enhancing our global support framework to deliver timely solutions and technical services tailored to regional needs.”