DIC Corporation is working to provide unique solutions in the area it has designated “chemitronics,” focusing on materials for semiconductor packaging and cutting-edge electronics components, demand for which is expected to grow in the future.

In line with this goal, DIC has resolved to build a new epoxy resins production facility at its Chiba Plant, located in the city of Ichihara, Chiba Prefecture. The decision to make this investment reflects the fact that the investment plan has been approved as a “plan for ensuring stable supply” by the Ministry of Economy, Trade and Industry (METI) under Japan’s Act on the Promotion of Ensuring National Security through Integrated Implementation of Economic Measures, as a result of which DIC is expected to receive a subsidy of up to ¥3 billion.

Epoxy resins are highly reactive thermosetting synthetic resins that boast exceptional moldability, heat resistance, electrical insulating properties and adhesiveness, and which are used in a wide range of industries.

The Chiba Plant’s existing epoxy resins production facility does not currently have sufficient supply capacity to meet the expected increase in demand going forward. Accordingly, by constructing a new facility adjacent to the existing one, DIC aims to secure additional production capacity for epoxy resins over the medium to long term, and to introduce new production processes that will deliver world-class quality and improved productivity, thereby enhancing its competitiveness.